Q2M Compound+ REDEFINED

Heavy cutting compound - improved

Achieve superior scratch removal and a high-gloss finish with the Q²M Compound+ REDEFINED 120ml. This heavy cutting paste delivers exceptional abrasion with minimal dust and secondary defects. While it leaves light holograms, they are easily removed with a single pass of Q²M Polish. The redefined formula enhances cutting power without sacrificing a smooth, glossy finish.  

Why Choose Q²M Compound+ REDEFINED?

• High Cutting Power: Delivers increased cutting power for effective scratch and defect removal.  
• Glossy Finish: Leaves a high-gloss finish, minimizing the need for extensive follow-up polishing.  
• Minimal Dust & Defects: Water-based formula with high-quality Japanese abrasives reduces dust and secondary defects.  
• Easy Pre-Coating Preparation: Contains no silicone or fillers, simplifying pre-coating preparation and polish removal.  
• Improved Formula: Part of GYEON's REDEFINED line, offering enhanced performance, durability, and ease of use.  
• Longer Working Cycle: Retains high cutting power and maintains a longer working cycle without drying out, ideal for high-temperature and humid climates.  

Key Features

• Heavy cutting compound.
• Improved scratch removal.
• High abrasion with minimal dust.  
• Water-based formula with Japanese abrasives.  
• No silicone or fillers.
• Longer working cycle.
• 120ml capacity.

Pro Tip

• Use with a rotary or dual-action polisher for optimal results.
• Work in small sections, moving the machine slowly across the surface.
• Reduce speed and temperature for best results due to its water-based formula.  
• Follow up with Q²M Polish for a perfect, hologram-free finish.